At the Hot Chips conference this week, Microsoft has shed some light on the hitherto secretive specifications of its augmented reality HoloLens. Now that anyone with $3,000 spare is able to buy a headset, there's never been more interest in what's actually inside the case powering the AR goodness. The holographic processing unit (HPU) at the heart of HoloLens is a seriously multi-cored beast. The Register reports that it is a "TSMC-fabricated 28nm coprocessor that has 24 Tensilica DSP cores". Of course, there's much more to the device than just this chip. The HPU is capable of processing a trillion… [Continue Reading]
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